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Applied Sciences
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Advances and Challenges in Micromechanics and Microengineering
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Advances and Challenges in Micromechanics and Microengineering

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Electrical, Electronics and Communications Engineering".

Deadline for manuscript submissions: 31 October 2026 | Viewed by 1310

Editor

Prof. Dr. Weiyu Liu

E-Mail Website
Guest Editor
School of Electronics and Control Engineering, Chang’an University, Xi’an 710064, China
Interests: micro-/nanofluidics; electrokinetics; micro-/nanofluids; moving contact lines; multiphase fluids and heat and mass transfer; wireless power transfer; inductive power transfer; constant current–constant voltage (CC–CV); electric vehicles (EVs)
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

This Special Issue aims to showcase cutting-edge research and practical advancements in microsystems and microengineering, with a focus on interdisciplinary integration and industrial translation. It covers a broad spectrum of topics, including MEMS design and fabrication, AI-driven microdevice intelligence, integrated circuit–microsystem synergy, and the application of microengineering in biomedical, industrial, and intelligent-sensing fields.

We welcome the submission of original research and review articles that address key challenges and innovations, such as nonlinear dynamics in micro/nanoscale manipulation, AI-empowered precision control of microsystems, system-in-package (SiP) integration of MEMS and electronics, self-powered microdevices, and intelligent microengineering solutions for healthcare, environmental monitoring, and advanced manufacturing. Contributions exploring the intersection of microengineering with AI, materials science, biomedicine, and robotics—especially those aligned with the demand for miniaturized, intelligent, and autonomous microsystems—are highly encouraged.

This Special Issue serves as a platform for researchers, engineers, and practitioners to exchange innovative ideas, share technical breakthroughs, and discuss future trends, thereby promoting the advancement of microsystems and microengineering toward having higher integration, smarter functionality, and broader interdisciplinary applications.

Prof. Dr. Weiyu Liu
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • microsystems
  • microengineering
  • MEMS
  • AI integration
  • integrated circuit integration
  • SiP packaging
  • intelligent microdevices
  • biomedical microengineering
  • self-powered microsystems
  • precision microfabrication

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Published Papers (2 papers)

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Research

20 pages, 3641 KB  
Article
An Improved SOC-Adaptive Droop Control for DC Microgrids with Enhanced Utilization and Economic Performance
by Xudong Wang, Saishuang Wang, Chunsheng Yang, Qisheng Wu, Zhigang Wei, Linyi Li, Jianglong Guo and Weiyu Liu
Appl. Sci. 2026, 16(14), 7358; https://doi.org/10.3390/app16147358 - 22 Jul 2026
Viewed by 494
Abstract
This paper proposes an improved state-of-charge (SOC)-based adaptive droop control strategy for photovoltaic DC microgrids with distributed energy storage units (DESUs). To overcome the slow SOC equalization and limited adaptability of conventional droop control methods, a nonlinear arctangent-based droop coefficient adjustment mechanism is [...] Read more.
This paper proposes an improved state-of-charge (SOC)-based adaptive droop control strategy for photovoltaic DC microgrids with distributed energy storage units (DESUs). To overcome the slow SOC equalization and limited adaptability of conventional droop control methods, a nonlinear arctangent-based droop coefficient adjustment mechanism is introduced to enhance regulation sensitivity under small SOC deviations. In addition, a capacity compensation factor and an acceleration term are incorporated to improve proportional power sharing and SOC convergence speed among heterogeneous storage units. To further evaluate the engineering significance of SOC balancing performance, a time-integrated SOC deviation index is introduced to analyze the cumulative imbalance effect on battery degradation and lifecycle operation. By reducing the SOC imbalance duration, the proposed strategy contributes to mitigating uneven battery aging and may potentially reduce long-term battery replacement costs. Simulation results under discharging, charging, and irradiance-variation scenarios demonstrate that the proposed strategy significantly improves SOC-balancing performance compared with conventional SOC-based droop control. Across the three operating modes, the average SOC balancing time has been reduced by 52.6%. The proposed method provides an effective and economically sustainable control framework for distributed energy storage coordination in DC microgrids. Full article
(This article belongs to the Special Issue Advances and Challenges in Micromechanics and Microengineering)
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14 pages, 2386 KB  
Article
The Edge Effects of Au Films on Electrical and Mechanical Properties
by Jiqun Zhu, Xiuli Li, Lili Cao, Zhensong Li and Wenyue Zhu
Appl. Sci. 2026, 16(14), 6870; https://doi.org/10.3390/app16146870 - 8 Jul 2026
Viewed by 387
Abstract
With the development of three-dimensional high-density integration, low-temperature co-fired ceramic (LTCC) technology has become an important substrate platform for electronic packaging. However, screen-printed Au films on LTCC substrates often contain boundary roughness, local thickness variation, pores, and particle-packing non-uniformity caused by the printing [...] Read more.
With the development of three-dimensional high-density integration, low-temperature co-fired ceramic (LTCC) technology has become an important substrate platform for electronic packaging. However, screen-printed Au films on LTCC substrates often contain boundary roughness, local thickness variation, pores, and particle-packing non-uniformity caused by the printing process. These features may affect both the macroscopic resistivity of printed patterns and the local mechanical response of the film. In this study, edge-related structural non-uniformity in screen-printed Au/LTCC films was evaluated using SEM observation, macroscopic resistivity–temperature fitting, nano-indentation, XRD, and nano-scratch testing. The resistivity results show that the stripe pattern has approximately 10–13% higher resistivity than the grid patterns within the measured temperature range, indicating a geometry-dependent electrical response. Nano-indentation results reveal large spatial dispersion in reduced modulus and hardness, and statistical analysis shows that differences among annealing conditions are not significant at the 0.05 level when indentation data alone are considered. Therefore, nanomechanical data are treated as an indirect structural indicator rather than a direct proof of local electrical uniformity. Among the investigated temperatures, 200 °C provides a favorable balance of local hardness, scratch resistance, and microstructural stability, whereas 300 °C should be interpreted cautiously because the higher scratch load is not supported by direct post-scratch failure analysis. Overall, the results provide a cautious but clear structure–property correlation for screen-printed Au/LTCC conductors and identify 200 °C as the preferred annealing condition among the investigated temperatures. These results provide practical guidance for evaluating structural non-uniformity in screen-printed Au/LTCC conductors. Full article
(This article belongs to the Special Issue Advances and Challenges in Micromechanics and Microengineering)
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