Advances and Challenges in Micromechanics and Microengineering
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Electrical, Electronics and Communications Engineering".
Deadline for manuscript submissions: 31 October 2026 | Viewed by 113
Special Issue Editor
Interests: micro-/nanofluidics; electrokinetics; micro-/nanofluids; moving contact lines; multiphase fluids and heat and mass transfer; wireless power transfer; inductive power transfer; constant current–constant voltage (CC–CV); electric vehicles (EVs)
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
This Special Issue aims to showcase cutting-edge research and practical advancements in microsystems and microengineering, with a focus on interdisciplinary integration and industrial translation. It covers a broad spectrum of topics, including MEMS design and fabrication, AI-driven microdevice intelligence, integrated circuit–microsystem synergy, and the application of microengineering in biomedical, industrial, and intelligent-sensing fields.
We welcome the submission of original research and review articles that address key challenges and innovations, such as nonlinear dynamics in micro/nanoscale manipulation, AI-empowered precision control of microsystems, system-in-package (SiP) integration of MEMS and electronics, self-powered microdevices, and intelligent microengineering solutions for healthcare, environmental monitoring, and advanced manufacturing. Contributions exploring the intersection of microengineering with AI, materials science, biomedicine, and robotics—especially those aligned with the demand for miniaturized, intelligent, and autonomous microsystems—are highly encouraged.
This Special Issue serves as a platform for researchers, engineers, and practitioners to exchange innovative ideas, share technical breakthroughs, and discuss future trends, thereby promoting the advancement of microsystems and microengineering toward having higher integration, smarter functionality, and broader interdisciplinary applications.
Prof. Dr. Weiyu Liu
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- microsystems
- microengineering
- MEMS
- AI integration
- integrated circuit integration
- SiP packaging
- intelligent microdevices
- biomedical microengineering
- self-powered microsystems
- precision microfabrication
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