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Hybrid and Heterogeneous Integration on Photonic Circuits
Topic Information
Dear Colleagues,
The field of silicon photonics has rapidly evolved over the last few years, supported by advances in the maturity of the technology, design tools, and methods employed. The quest for new ideas and concepts to deploy low-cost, compact, and power-efficient photonic circuits with a high wafer yield and robustness that are able to meet the requirements in several application domains has triggered frenetic activity worldwide. Presently, photonic circuit technology has diversified its number of available platforms. Despite the fact that indium phosphide (InP) and silicon-on-insulator (SOI) platforms are still considered the warhorses of integrated photonics in terms of maturity and the deployment of active (InP) and passive (SOI) components, other alternatives such as germanium-on-silicon, silicon nitride-on-insulator, or hybrid solutions combining different functional materials and Si are gaining momentum. A representative example is the hybrid III-V/Si platform, which has been used to develop on-chip tunable lasers for wavelength division multiplexing purposes. Indeed, the possibility to integrate several materials in a single photonic technology represents an attractive playground scenario to explore novel functionalities not available before in monolithic approaches. In this regard, the implementation of multifunctional photonic circuits that collect, transmit, or reconfigure data in real-time conditions while interacting with their environment may open the route for a new class of photonic circuits with a wide range of possibilities and applications. This Topic will focus on recent advancements in hybrid and heterogeneous photonic circuits covering materials, processing techniques, and the implementation of novel components, devices, and circuits employing diverse materials to enable multifunctional photonic platforms. With a combination of invited and contributed papers, this Topic will survey the state-of-the-art of hybrid and heterogeneous photonic circuit technology.
Dr. Joan Manel Ramírez
Dr. Carlos Alberto Alonso-Ramos
Topic Editors
Keywords
- silicon photonics
- photonic integrated circuits (PICs)
- heterogeneous integration
- multifunctional photonics
- reconfigurable photonics
- waveguides
- integrated lasers and semiconductor optical amplifiers (SOAs)
- indium phosphide photonics
- wafer bonding
- die bonding
- optical communications
- sensors and actuators
- high-speed optical components
- 3D photonics
- functional materials for photonics
Participating Journals
| Journal Name | Impact Factor | CiteScore | Launched Year | First Decision (median) | APC |
|---|---|---|---|---|---|
Applied Sciences
|
2.5 | 5.3 | 2011 | 18.4 Days | CHF 2400 |
Journal of Manufacturing and Materials Processing
|
3.3 | 5.1 | 2017 | 16.5 Days | CHF 1800 |
Materials
|
3.1 | 5.8 | 2008 | 13.9 Days | CHF 2600 |
Photonics
|
2.1 | 2.6 | 2014 | 14.9 Days | CHF 2400 |
Plasma
|
1.9 | 2.3 | 2018 | 26.8 Days | CHF 1400 |
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