Topic Editors

Nokia Bell Labs France, III-V Lab, 1 Avenue Augustin Fresnel, 91767 Palaiseau, France
Dr. Carlos Alberto Alonso-Ramos
Centre for Nanoscience and Nanotechnology, Université Paris Saclay - CNRS, 91120 Palaiseau, France

Hybrid and Heterogeneous Integration on Photonic Circuits

Abstract submission deadline
closed (31 December 2023)
Manuscript submission deadline
31 May 2024
Viewed by

Topic Information

Dear Colleagues,

The field of silicon photonics has rapidly evolved over the last few years, supported by advances in the maturity of the technology, design tools, and methods employed. The quest for new ideas and concepts to deploy low-cost, compact, and power-efficient photonic circuits with a high wafer yield and robustness that are able to meet the requirements in several application domains has triggered frenetic activity worldwide. Presently, photonic circuit technology has diversified its number of available platforms. Despite the fact that indium phosphide (InP) and silicon-on-insulator (SOI) platforms are still considered the warhorses of integrated photonics in terms of maturity and the deployment of active (InP) and passive (SOI) components, other alternatives such as germanium-on-silicon, silicon nitride-on-insulator, or hybrid solutions combining different functional materials and Si are gaining momentum. A representative example is the hybrid III-V/Si platform, which has been used to develop on-chip tunable lasers for wavelength division multiplexing purposes. Indeed, the possibility to integrate several materials in a single photonic technology represents an attractive playground scenario to explore novel functionalities not available before in monolithic approaches. In this regard, the implementation of multifunctional photonic circuits that collect, transmit, or reconfigure data in real-time conditions while interacting with their environment may open the route for a new class of photonic circuits with a wide range of possibilities and applications. This Topic will focus on recent advancements in hybrid and heterogeneous photonic circuits covering materials, processing techniques, and the implementation of novel components, devices, and circuits employing diverse materials to enable multifunctional photonic platforms. With a combination of invited and contributed papers, this Topic will survey the state-of-the-art of hybrid and heterogeneous photonic circuit technology.

Dr. Joan Manel Ramírez
Dr. Carlos Alberto Alonso-Ramos
Topic Editors


  • silicon photonics
  • photonic integrated circuits (PICs)
  • heterogeneous integration
  • multifunctional photonics
  • reconfigurable photonics
  • waveguides
  • integrated lasers and semiconductor optical amplifiers (SOAs)
  • indium phosphide photonics
  • wafer bonding
  • die bonding
  • optical communications
  • sensors and actuators
  • high-speed optical components
  • 3D photonics
  • functional materials for photonics

Participating Journals

Journal Name Impact Factor CiteScore Launched Year First Decision (median) APC
Applied Sciences
2.7 4.5 2011 16.9 Days CHF 2400 Submit
Journal of Manufacturing and Materials Processing
3.2 5.5 2017 14.2 Days CHF 1800 Submit
3.4 5.2 2008 13.9 Days CHF 2600 Submit
2.4 2.3 2014 15.5 Days CHF 2400 Submit
- - 2018 32.4 Days CHF 1400 Submit is a multidiscipline platform providing preprint service that is dedicated to sharing your research from the start and empowering your research journey.

MDPI Topics is cooperating with and has built a direct connection between MDPI journals and Authors are encouraged to enjoy the benefits by posting a preprint at prior to publication:

  1. Immediately share your ideas ahead of publication and establish your research priority;
  2. Protect your idea from being stolen with this time-stamped preprint article;
  3. Enhance the exposure and impact of your research;
  4. Receive feedback from your peers in advance;
  5. Have it indexed in Web of Science (Preprint Citation Index), Google Scholar, Crossref, SHARE, PrePubMed, Scilit and Europe PMC.

Published Papers (1 paper)

Order results
Result details
Select all
Export citation of selected articles as:
16 pages, 9701 KiB  
Compact Quantum Random Number Generator Based on a Laser Diode and a Hybrid Chip with Integrated Silicon Photonics
by Xuyang Wang, Tao Zheng, Yanxiang Jia, Jin Huang, Xinyi Zhu, Yuqi Shi, Ning Wang, Zhenguo Lu, Jun Zou and Yongmin Li
Photonics 2024, 11(5), 468; - 16 May 2024
Viewed by 181
In this study, a compact and low-power-consumption quantum random number generator (QRNG) based on a laser diode and a hybrid chip with integrated silicon photonics is proposed and verified experimentally. The hybrid chip’s size is 8.8 × 2.6 × 1 mm3, [...] Read more.
In this study, a compact and low-power-consumption quantum random number generator (QRNG) based on a laser diode and a hybrid chip with integrated silicon photonics is proposed and verified experimentally. The hybrid chip’s size is 8.8 × 2.6 × 1 mm3, and the power of the entropy source is 80 mW. A common-mode rejection ratio greater than 40 dB was achieved using an optimized 1 × 2 multimode interferometer structure. A method for optimizing the quantum-to-classical noise ratio is presented. A quantum-to-classical noise ratio of approximately 9 dB was achieved when the photoelectron current is 1 μA using a balance homodyne detector with a high dark current GeSi photodiode. The proposed QRNG has the potential for use in scenarios of moderate MHz random number generation speed, with low power, small volume, and low cost prioritized. Full article
(This article belongs to the Topic Hybrid and Heterogeneous Integration on Photonic Circuits)
Show Figures

Figure 1

Back to TopTop