Advances in Optical Communication and Photonic Integrated Devices
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Optics and Lasers".
Deadline for manuscript submissions: 20 September 2026 | Viewed by 572
Special Issue Editor
Interests: optical networks; wireless networks; photonic integrated circuits; sensors; nature-inspired algorithms; robotics
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Recent progress in optical communications is being driven by AI/datacenter bandwidth demands and tighter power budgets. Roadmaps are rapidly moving from 400G to 800G and 1.6T-class links, with heavy emphasis on higher-order modulation, coherent DSP, and photonic–electronic co-design to keep reach while reducing energy/bit. In parallel, co-packaged optics (CPO) and optical I/O concepts are accelerating to relieve electrical I/O bottlenecks by placing photonics closer to compute, enabling higher aggregate bandwidth and improved scaling for multi-chip systems. On the device side, silicon photonics continues to mature for high-volume interconnects, while platforms like thin-film lithium niobate and microcombs are expanding the toolbox for high-linearity modulators, dense wavelength sources, and scalable integrated systems. Security-oriented photonics is also advancing via integrated/ML-enabled encryption and optical-chaos-based communication refinements.
Prof. Dr. Gerardo Antonio Castañón-Avila
Guest Editor
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Keywords
- optical communications
- silicon photonics
- co-packaged optics
- optical I/O
- coherent DSP
- 800G/1.6T transceivers
- thin-film lithium niobate
- microcombs
- secure photonics
- optical chaos communication
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