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Flexible and Printed Electronics
This special issue belongs to the section “Electrical, Electronics and Communications Engineering“.
Special Issue Information
Dear Colleagues,
Foldable and bendable devices have been commercialized, and the flexible electronics market has been rapidly expanded. Accordingly, flexible electronics have been considered as the next paradigm following the smartphone. Flexible and printed electronics have been significantly developed over the last two decades, from conductive films to biomedical products. However, there are still many scientific and engineering obstacles blocking the complete paradigm shift to flexible electronics.
This Special Issue aims to bring together the latest innovative advances in the materials, processes, and applications of flexible and printed electronics.
Topics for this Special Issue include, but are not limited to, the following topics:
▪ Synthesis of organic and inorganic materials;
▪ Flexible and printed electronics;
▪ Stretchable electronics;
▪ Bioelectronics and biosensors;
▪ Coating and printing;
▪ Roll-to-roll manufacturing;
▪ Reliability in flexible and printed devices;
▪ Artificial intelligence in flexible and printed devices.
Prof. Jongsu Lee
Prof. Changwoo Lee
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- organic materials
- inorganic materials
- coating
- printing
- roll-to-roll
- flexible device
- printed device
- stretchable device
- reliability test
- artificial intelligence
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