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Augmented and Virtual Reality for Smart Applications

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Computing and Artificial Intelligence".

Deadline for manuscript submissions: 20 February 2026 | Viewed by 9

Special Issue Editor


E-Mail Website
Guest Editor
Department of Computer Science, Kwangwoon University, 447-1, Wolgye-Dong, Nowon-Gu, Seoul 139-701, Republic of Korea
Interests: computer animation; human–computer interfaces; virtual reality; embodied agents

Special Issue Information

Dear Colleagues,

This Special Issue explores the transformative potential of augmented reality (AR) and virtual reality (VR) in developing intelligent and innovative applications across various domains. We aim to highlight cutting-edge research, novel methodologies, and practical applications that leverage AR/VR technologies to create more immersive, interactive, and efficient solutions for real-world challenges. Topics of particular interest include, but are not limited to, advanced human–computer interaction (HCI) paradigms within AR/VR environments, the seamless integration of artificial intelligence (AI) with AR/VR for profoundly enhanced user experiences, and significant advancements in both hardware and software specifically tailored for smart AR/VR applications. We especially welcome contributions focusing on controlling embodied agents within virtual environments, innovative approaches to building and rendering augmented/virtual environments, and the development of interactive simulations for various applications. Furthermore, we invite research exploring the application of AR/VR in critical sectors such as education, healthcare, advanced manufacturing, interactive entertainment, and smart urban planning. We highly encourage submissions that present original research, comprehensive review articles, and insightful case studies that collectively demonstrate the substantial and evolving contributions of AR/VR to the development of truly smart and impactful applications.

Dr. Kang Hoon Lee
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • augmented reality (AR)
  • virtual reality (VR)
  • mixed reality (MR)
  • human–computer interaction (HCI)
  • immersive technologies
  • smart applications
  • ubiquitous computing
  • artificial intelligence (AI) for AR/VR
  • computer vision for AR/VR
  • real-time rendering
  • 3D interaction
  • embodied agents
  • digital twins
  • wearable technology
  • virtual environment creation
  • interactive simulation
  • agent control
  • interactive entertainment

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Published Papers

This special issue is now open for submission.
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