Special Issue "Material and Structural Design of Novel Adhesives and Adhesive Systems"
A special issue of ChemEngineering (ISSN 2305-7084).
Deadline for manuscript submissions: closed (30 March 2020).
Interests: mechanical behavior of adhesives, polymers, composites; design and manufacture with novel materials; excimer laser applications in polymers; electrically conductive adhesives and polymers; nanoprocessing, nanocomposites, and nanodevices
Chemical and architectural design of adhesives and adhesive systems for creative applications in engineering and medicine is the focus of this Special Issue. Highly demanding and often very specific engineering and medical applications of our current technology require complicated chemistries, morphologies, and structures in composite/hybrid and organic/inorganic combinations. Thus, precise control over various material and process properties is needed for such “tailor-made” adhesives. Applications may involve novel considerations for “wetting-and-setting”, underwater adhesives, de-adhesion, adhesion/de-adhesion reversible adhesives, impact resistance, replacement of current connection/joining methods by adhesive bonding and design methodologies for that purpose, electrical and thermal conductivity, radar-absorption, controlled release, and medical functions. The associated design processes may involve and even require biomimetics, functional/smart adhesives, self-healing adhesives, biomedical adhesives for clinical applications, multiresponse adhesives, interphase design, reversible sacrificial bonds, hydrogel applications, and advanced manufacturing of and with adhesives and novel toughening mechanisms. As always, the challenge is the proper balance of adhesive properties which change with specific application. Such properties may involve the traditional concerns of mechanical performance with acceptable cohesive and shear strength, chemical inertness, tackiness, stable aging and chemical/structural balance, and low toxicity.
With these considerations, I would like to invite research articles, review articles, as well as short communications for this Special Issue on “Material and Structural Design of Novel Adhesives and Adhesive Systems”. Please note that manuscripts can be submitted until the deadline and will be published continuously in the journal as soon as accepted, and they will be listed together on the Special Issue website.
Prof. Dr. Erol Sancaktar
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. ChemEngineering is an international peer-reviewed open access quarterly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- Novel adhesive chemistries
- Morphologies, nanostructures
- Composite/hybrid systems and structures
- Organic/inorganic combinations
- Biomimetic designs
- Functional/smart adhesives
- Self-healing adhesives
- Biomedical adhesives for clinical applications
- Multiresponse adhesives
- Interphase design
- Reversible sacrificial bonds
- Hydrogel applications
- Advanced manufacturing of and with adhesives
- Novel toughening mechanisms, impact resistance
- Novel considerations for “wetting-and-setting”
- Underwater adhesives
- Adhesion/de-adhesion reversible adhesives
- Design methodologies for current connection/joining methods replacement by adhesive bonding
- Design of structure-function relationships
- Electrical and thermal conductivity
- Controlled release and medical functions