Material and Structural Design of Novel Adhesives and Adhesive Systems

Dear Colleagues,

Chemical and architectural design of adhesives and adhesive systems for creative applications in engineering and medicine is the focus of this Special Issue. Highly demanding and often very specific engineering and medical applications of our current technology require complicated chemistries, morphologies, and structures in composite/hybrid and organic/inorganic combinations. Thus, precise control over various material and process properties is needed for such “tailor-made” adhesives. Applications may involve novel considerations for “wetting-and-setting”, underwater adhesives, de-adhesion, adhesion/de-adhesion reversible adhesives, impact resistance, replacement of current connection/joining methods by adhesive bonding and design methodologies for that purpose, electrical and thermal conductivity, radar-absorption, controlled release, and medical functions. The associated design processes may involve and even require biomimetics, functional/smart adhesives, self-healing adhesives, biomedical adhesives for clinical applications, multiresponse adhesives, interphase design, reversible sacrificial bonds, hydrogel applications, and advanced manufacturing of and with adhesives and novel toughening mechanisms. As always, the challenge is the proper balance of adhesive properties which change with specific application. Such properties may involve the traditional concerns of mechanical performance with acceptable cohesive and shear strength, chemical inertness, tackiness, stable aging and chemical/structural balance, and low toxicity.

With these considerations, I would like to invite research articles, review articles, as well as short communications for this Special Issue on “Material and Structural Design of Novel Adhesives and Adhesive Systems”. Please note that manuscripts can be submitted until the deadline and will be published continuously in the journal as soon as accepted, and they will be listed together on the Special Issue website.

Prof. Dr. Erol Sancaktar
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. ChemEngineering is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.