Reniers, S.; Wang, Y.; Abdi, S.; de Graaf, J.; Zozulia, A.; Williams, K.; Jiao, Y.
Highly Versatile Photonic Integration Platform on an Indium Phosphide Membrane. Chips 2025, 4, 32.
https://doi.org/10.3390/chips4030032
AMA Style
Reniers S, Wang Y, Abdi S, de Graaf J, Zozulia A, Williams K, Jiao Y.
Highly Versatile Photonic Integration Platform on an Indium Phosphide Membrane. Chips. 2025; 4(3):32.
https://doi.org/10.3390/chips4030032
Chicago/Turabian Style
Reniers, Sander, Yi Wang, Salim Abdi, Jasper de Graaf, Aleksandr Zozulia, Kevin Williams, and Yuqing Jiao.
2025. "Highly Versatile Photonic Integration Platform on an Indium Phosphide Membrane" Chips 4, no. 3: 32.
https://doi.org/10.3390/chips4030032
APA Style
Reniers, S., Wang, Y., Abdi, S., de Graaf, J., Zozulia, A., Williams, K., & Jiao, Y.
(2025). Highly Versatile Photonic Integration Platform on an Indium Phosphide Membrane. Chips, 4(3), 32.
https://doi.org/10.3390/chips4030032