Kim, S.; Chae, S.; Seo, M.; Kim, Y.; Park, S.; Park, S.; Nam, H.
Development of Low-Dielectric Modified Polyimide with Low-Temperature Radical Curing for High-Frequency Flexible Printed Circuit Boards. Micro 2025, 5, 23.
https://doi.org/10.3390/micro5020023
AMA Style
Kim S, Chae S, Seo M, Kim Y, Park S, Park S, Nam H.
Development of Low-Dielectric Modified Polyimide with Low-Temperature Radical Curing for High-Frequency Flexible Printed Circuit Boards. Micro. 2025; 5(2):23.
https://doi.org/10.3390/micro5020023
Chicago/Turabian Style
Kim, Seonwoo, Suin Chae, Mirae Seo, Yubin Kim, Soobin Park, Sehoon Park, and Hyunjin Nam.
2025. "Development of Low-Dielectric Modified Polyimide with Low-Temperature Radical Curing for High-Frequency Flexible Printed Circuit Boards" Micro 5, no. 2: 23.
https://doi.org/10.3390/micro5020023
APA Style
Kim, S., Chae, S., Seo, M., Kim, Y., Park, S., Park, S., & Nam, H.
(2025). Development of Low-Dielectric Modified Polyimide with Low-Temperature Radical Curing for High-Frequency Flexible Printed Circuit Boards. Micro, 5(2), 23.
https://doi.org/10.3390/micro5020023