Wei, Q.; Xie, B.; Lu, Y.; Chen, D.; Chen, J.; Wang, J.
An Analytical Method for Modelling Pull-In Effect during Anodic Bonding. Proceedings 2018, 2, 969.
https://doi.org/10.3390/proceedings2130969
AMA Style
Wei Q, Xie B, Lu Y, Chen D, Chen J, Wang J.
An Analytical Method for Modelling Pull-In Effect during Anodic Bonding. Proceedings. 2018; 2(13):969.
https://doi.org/10.3390/proceedings2130969
Chicago/Turabian Style
Wei, Qiuxu, Bo Xie, Yulan Lu, Deyong Chen, Jian Chen, and Junbo Wang.
2018. "An Analytical Method for Modelling Pull-In Effect during Anodic Bonding" Proceedings 2, no. 13: 969.
https://doi.org/10.3390/proceedings2130969
APA Style
Wei, Q., Xie, B., Lu, Y., Chen, D., Chen, J., & Wang, J.
(2018). An Analytical Method for Modelling Pull-In Effect during Anodic Bonding. Proceedings, 2(13), 969.
https://doi.org/10.3390/proceedings2130969