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Journal: Proceedings, 2018
Volume: 2
Number: 776
776
Article: On-Chip Thermal Insulation Using Porous GaN
Authors: by Bogdan F. Spiridon, Peter H. Griffin, John C. Jarman, Yingjun Liu, Tongtong Zhu, Andrea De Luca, Rachel A. Oliver and Florin Udrea
Link: https://www.mdpi.com/2504-3900/2/13/776

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