Elsobky, M.; Alavi, G.; Albrecht, B.; Deuble, T.; Harendt, C.; Richter, H.; Yu, Z.; Burghartz, J.N.
Ultra-Thin Sensor Systems Integrating Silicon Chips with On-Foil Passive and Active Components. Proceedings 2018, 2, 748.
https://doi.org/10.3390/proceedings2130748
AMA Style
Elsobky M, Alavi G, Albrecht B, Deuble T, Harendt C, Richter H, Yu Z, Burghartz JN.
Ultra-Thin Sensor Systems Integrating Silicon Chips with On-Foil Passive and Active Components. Proceedings. 2018; 2(13):748.
https://doi.org/10.3390/proceedings2130748
Chicago/Turabian Style
Elsobky, Mourad, Golzar Alavi, Björn Albrecht, Thomas Deuble, Christine Harendt, Harald Richter, Zili Yu, and Joachim N. Burghartz.
2018. "Ultra-Thin Sensor Systems Integrating Silicon Chips with On-Foil Passive and Active Components" Proceedings 2, no. 13: 748.
https://doi.org/10.3390/proceedings2130748
APA Style
Elsobky, M., Alavi, G., Albrecht, B., Deuble, T., Harendt, C., Richter, H., Yu, Z., & Burghartz, J. N.
(2018). Ultra-Thin Sensor Systems Integrating Silicon Chips with On-Foil Passive and Active Components. Proceedings, 2(13), 748.
https://doi.org/10.3390/proceedings2130748
