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Journal: Photonics, 2025
Volume: 12
Number: 821

Article: Photonic Integrated Circuits: Research Advances and Challenges in Interconnection and Packaging Technologies
Authors: by Wenchao Tian, Yifan Wang, Haojie Dang, Huahua Hou and Yuanyuan Xi
Link: https://www.mdpi.com/2304-6732/12/8/821

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