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Mathematical and Computational Applications is published by MDPI from Volume 21 Issue 1 (2016). Articles in this Issue were published by another publisher in Open Access under a CC-BY (or CC-BY-NC-ND) licence. Articles are hosted by MDPI on as a courtesy and upon agreement with the previous journal publisher.
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Math. Comput. Appl. 1998, 3(2), 101-111;

Three Dimensional Stress Anaysis in Adhesively Bonded Joints

Department of Mechanical Education, Sakarya University, Sakarya, Turkey
Department of Mechanical Engineering, Celal Bayar University, 45140 Muradiye / Manisa, Turkey
Author to whom correspondence should be addressed.
Published: 1 August 1998
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Stress and strain distributions in the adhesive bonded joints subjected to distributed forces are investigated using finite element method. Two different cases are considered, the bonded materials are the same, and the bonded materials are different. The investigations are conducted on a three dimensional model. The finite element model of the joint is obtained using isoparametric three dimensional elements having eight nodes with three degrees of freedom each. The stress components and their distributions both on adhesive surface and on metallic elements are given in dimensionless form using three dimensional graphics.
This is an open access article distributed under the Creative Commons Attribution License (CC BY 3.0).

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Kaya, A.; Tekelioğlu, M. Three Dimensional Stress Anaysis in Adhesively Bonded Joints. Math. Comput. Appl. 1998, 3, 101-111.

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