Kotike, J.; Beedalannagari, O.; Rekapalli, L.; Usman, M.; Kadavakollu, K.R.
Neural Network Modeling of CuO/Au Hybrid Nanofluid Thermal Performance with Slip Effects for Advanced Process Applications. Processes 2025, 13, 516.
https://doi.org/10.3390/pr13020516
AMA Style
Kotike J, Beedalannagari O, Rekapalli L, Usman M, Kadavakollu KR.
Neural Network Modeling of CuO/Au Hybrid Nanofluid Thermal Performance with Slip Effects for Advanced Process Applications. Processes. 2025; 13(2):516.
https://doi.org/10.3390/pr13020516
Chicago/Turabian Style
Kotike, Jyothi, Omprakash Beedalannagari, Leelavathi Rekapalli, Muhammad Usman, and Kalyani Radha Kadavakollu.
2025. "Neural Network Modeling of CuO/Au Hybrid Nanofluid Thermal Performance with Slip Effects for Advanced Process Applications" Processes 13, no. 2: 516.
https://doi.org/10.3390/pr13020516
APA Style
Kotike, J., Beedalannagari, O., Rekapalli, L., Usman, M., & Kadavakollu, K. R.
(2025). Neural Network Modeling of CuO/Au Hybrid Nanofluid Thermal Performance with Slip Effects for Advanced Process Applications. Processes, 13(2), 516.
https://doi.org/10.3390/pr13020516