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        Journal: Electronics, 2025
        Volume: 14 
                	Number: 1726 
                
        
        Article:
        Life Prediction Model for Press-Pack IGBT Module Based on Thermal Resistance Degradation 
        Authors: 
       	by
                    Rui Zhou, Xiang Wang, Jianqiang Li, Tong An, Zhengqiang Yu, Xiaochen Wang and Yan Li        
        Link:
        https://www.mdpi.com/2079-9292/14/9/1726
        
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