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Journal: Electronics, 2025
Volume: 14
Number: 1726

Article: Life Prediction Model for Press-Pack IGBT Module Based on Thermal Resistance Degradation
Authors: by Rui Zhou, Xiang Wang, Jianqiang Li, Tong An, Zhengqiang Yu, Xiaochen Wang and Yan Li
Link: https://www.mdpi.com/2079-9292/14/9/1726

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