Zhou, R.; Wang, X.; Li, J.; An, T.; Yu, Z.; Wang, X.; Li, Y.
Life Prediction Model for Press-Pack IGBT Module Based on Thermal Resistance Degradation. Electronics 2025, 14, 1726.
https://doi.org/10.3390/electronics14091726
AMA Style
Zhou R, Wang X, Li J, An T, Yu Z, Wang X, Li Y.
Life Prediction Model for Press-Pack IGBT Module Based on Thermal Resistance Degradation. Electronics. 2025; 14(9):1726.
https://doi.org/10.3390/electronics14091726
Chicago/Turabian Style
Zhou, Rui, Xiang Wang, Jianqiang Li, Tong An, Zhengqiang Yu, Xiaochen Wang, and Yan Li.
2025. "Life Prediction Model for Press-Pack IGBT Module Based on Thermal Resistance Degradation" Electronics 14, no. 9: 1726.
https://doi.org/10.3390/electronics14091726
APA Style
Zhou, R., Wang, X., Li, J., An, T., Yu, Z., Wang, X., & Li, Y.
(2025). Life Prediction Model for Press-Pack IGBT Module Based on Thermal Resistance Degradation. Electronics, 14(9), 1726.
https://doi.org/10.3390/electronics14091726