Yin, Y.; Xia, C.; Liu, S.; Zhang, Z.; Chen, C.; Wang, G.; Wang, C.; Wu, Y.
Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications. Electronics 2024, 13, 839.
https://doi.org/10.3390/electronics13050839
AMA Style
Yin Y, Xia C, Liu S, Zhang Z, Chen C, Wang G, Wang C, Wu Y.
Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications. Electronics. 2024; 13(5):839.
https://doi.org/10.3390/electronics13050839
Chicago/Turabian Style
Yin, Yuhang, Chenhui Xia, Shuli Liu, Zhimo Zhang, Chen Chen, Gang Wang, Chenqian Wang, and Yafei Wu.
2024. "Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications" Electronics 13, no. 5: 839.
https://doi.org/10.3390/electronics13050839
APA Style
Yin, Y., Xia, C., Liu, S., Zhang, Z., Chen, C., Wang, G., Wang, C., & Wu, Y.
(2024). Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications. Electronics, 13(5), 839.
https://doi.org/10.3390/electronics13050839