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Appl. Sci. 2018, 8(5), 736; https://doi.org/10.3390/app8050736

MHD Steady/Unsteady Porous Boundary Layer of Cu–Water Nanofluid with Micropolar Effect over a Permeable Surface

1
Mathematics Department, Faculty of Science, Al-azhar University, Cairo 002, Egypt
2
Mathematics Department, Faculty of Science, Tanta University, Tanta 002, Egypt
3
Basic Science Department, Faculty of Engineering, Benha University, Cairo 002, Egypt
*
Authors to whom correspondence should be addressed.
Received: 5 March 2018 / Revised: 26 March 2018 / Accepted: 3 April 2018 / Published: 7 May 2018
(This article belongs to the Special Issue Nanofluids and Their Applications)
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Abstract

This work provides a mathematical model for the cooling process of a moving surface, in the presence of a uniform external magnetic field and thermal radiation, through a porous medium by using a weak concentration micropolar nanofluid. The model—based on the conservation equations of the unsteady case in the momentum and thermal boundary layer—takes into consideration the effect of the suction process. The conservation equations were transformed into ordinary differential equations using similar transformation techniques. The equations were solved numerically for the general case and analytically for the steady case. The rate of heat transfer, couple shear stress, and surface shear stress are deduced. We discuss the impact of these physical characteristics on the mechanical properties of the surface that will be cooled. View Full-Text
Keywords: nanofluids; micropolar; cooling process; mechanical properties nanofluids; micropolar; cooling process; mechanical properties
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
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Raslan, K.; Mohamadain, S.; Abdel-wahed, M.; Abedel-aal, E.M. MHD Steady/Unsteady Porous Boundary Layer of Cu–Water Nanofluid with Micropolar Effect over a Permeable Surface. Appl. Sci. 2018, 8, 736.

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