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Journal: Appl. Sci., 2024
Volume: 14
Number: 4252

Article: Impact of Ar/CF4 Mixed Gas Flow Rate on Silicon Etching Using Surface Discharge Plasma
Authors: by Toshiyuki Hamada, Kazuki Nishida and Masafumi Yoshida
Link: https://www.mdpi.com/2076-3417/14/10/4252

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