Wang, H.; Zhang, H.; Zhou, M.; Gu, C.; Bai, S.; Lin, H.
Study of Surface Defect Detection Techniques in Grinding of SiCp/Al Composites. Appl. Sci. 2023, 13, 11961.
https://doi.org/10.3390/app132111961
AMA Style
Wang H, Zhang H, Zhou M, Gu C, Bai S, Lin H.
Study of Surface Defect Detection Techniques in Grinding of SiCp/Al Composites. Applied Sciences. 2023; 13(21):11961.
https://doi.org/10.3390/app132111961
Chicago/Turabian Style
Wang, Haotao, Haijun Zhang, Ming Zhou, Chengbo Gu, Sutong Bai, and Hao Lin.
2023. "Study of Surface Defect Detection Techniques in Grinding of SiCp/Al Composites" Applied Sciences 13, no. 21: 11961.
https://doi.org/10.3390/app132111961
APA Style
Wang, H., Zhang, H., Zhou, M., Gu, C., Bai, S., & Lin, H.
(2023). Study of Surface Defect Detection Techniques in Grinding of SiCp/Al Composites. Applied Sciences, 13(21), 11961.
https://doi.org/10.3390/app132111961