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Open AccessArticle

Out-of-Plane Bending of Functionally Graded Thin Plates with a Circular Hole

1
Jiangsu Province Key Laboratory of Advanced Manufacturing Technology, Huaiyin Institute of Technology, Huai’an 223003, China
2
Department of Civil Engineering, Zhejiang Sci-Tech University, Hangzhou 310018, China
*
Author to whom correspondence should be addressed.
Appl. Sci. 2020, 10(7), 2231; https://doi.org/10.3390/app10072231
Received: 12 February 2020 / Revised: 9 March 2020 / Accepted: 21 March 2020 / Published: 25 March 2020
(This article belongs to the Special Issue Functionally Graded Materials)
The out-of-plane bending problems of functionally graded thin plates with a circular hole are studied for two-dimensional deformations. The thin plates have arbitrary variations of elastic properties along the radial direction. The general solutions of the stresses and moments are presented for the plates subjected to remote bending moments based on the theory of complex variable functions. Two different cases—a whole functionally graded plate with a circular hole and a functionally graded ring reinforced in a homogeneous perforated plate—are considered by numerical examples. The influence of parameters like Young’s modulus and Poisson’s ratio, function types of these elastic properties, and width of the reinforcing ring on the moments around the hole is presented. It is shown that the moment concentration, caused by the geometric discontinuity of the hole in the traditional homogeneous plate, can be well relieved or even eliminated by careful selection of the above parameters. The results for some special cases are compared with previous literatures and are found in good agreement. View Full-Text
Keywords: out-of-plane bending; circular hole; moment concentration; graded thin plate; complex variable method out-of-plane bending; circular hole; moment concentration; graded thin plate; complex variable method
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Yang, Q.; Cao, H.; Tang, Y.; Yang, B. Out-of-Plane Bending of Functionally Graded Thin Plates with a Circular Hole. Appl. Sci. 2020, 10, 2231.

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