Samouhos, M.;                     Peppas, A.;                     Angelopoulos, P.;                     Taxiarchou, M.;                     Tsakiridis, P.    
        Optimization of Copper Thermocompression Diffusion Bonding under Vacuum: Microstructural and Mechanical Characteristics. Metals 2019, 9, 1044.
    https://doi.org/10.3390/met9101044
    AMA Style
    
                                Samouhos M,                                 Peppas A,                                 Angelopoulos P,                                 Taxiarchou M,                                 Tsakiridis P.        
                Optimization of Copper Thermocompression Diffusion Bonding under Vacuum: Microstructural and Mechanical Characteristics. Metals. 2019; 9(10):1044.
        https://doi.org/10.3390/met9101044
    
    Chicago/Turabian Style
    
                                Samouhos, Michail,                                 Antonis Peppas,                                 Panagiotis Angelopoulos,                                 Maria Taxiarchou,                                 and Petros Tsakiridis.        
                2019. "Optimization of Copper Thermocompression Diffusion Bonding under Vacuum: Microstructural and Mechanical Characteristics" Metals 9, no. 10: 1044.
        https://doi.org/10.3390/met9101044
    
    APA Style
    
                                Samouhos, M.,                                 Peppas, A.,                                 Angelopoulos, P.,                                 Taxiarchou, M.,                                 & Tsakiridis, P.        
        
        (2019). Optimization of Copper Thermocompression Diffusion Bonding under Vacuum: Microstructural and Mechanical Characteristics. Metals, 9(10), 1044.
        https://doi.org/10.3390/met9101044