Nevárez-Llamas, É.D.;                     Araneda-Hernández, E.A.;                     Parra-Sánchez, V.R.;                     Villagrán-Guerra, E.A.    
        Effect of Glue, Thiourea, and Chloride on the Electrochemical Reduction in CuSO4–H2SO4 Solutions. Metals 2023, 13, 891.
    https://doi.org/10.3390/met13050891
    AMA Style
    
                                Nevárez-Llamas ÉD,                                 Araneda-Hernández EA,                                 Parra-Sánchez VR,                                 Villagrán-Guerra EA.        
                Effect of Glue, Thiourea, and Chloride on the Electrochemical Reduction in CuSO4–H2SO4 Solutions. Metals. 2023; 13(5):891.
        https://doi.org/10.3390/met13050891
    
    Chicago/Turabian Style
    
                                Nevárez-Llamas, Érika D.,                                 Eugenia A. Araneda-Hernández,                                 VÃctor R. Parra-Sánchez,                                 and Eduardo A. Villagrán-Guerra.        
                2023. "Effect of Glue, Thiourea, and Chloride on the Electrochemical Reduction in CuSO4–H2SO4 Solutions" Metals 13, no. 5: 891.
        https://doi.org/10.3390/met13050891
    
    APA Style
    
                                Nevárez-Llamas, É. D.,                                 Araneda-Hernández, E. A.,                                 Parra-Sánchez, V. R.,                                 & Villagrán-Guerra, E. A.        
        
        (2023). Effect of Glue, Thiourea, and Chloride on the Electrochemical Reduction in CuSO4–H2SO4 Solutions. Metals, 13(5), 891.
        https://doi.org/10.3390/met13050891