Nevárez-Llamas, É.D.; Araneda-Hernández, E.A.; Parra-Sánchez, V.R.; Villagrán-Guerra, E.A.
Effect of Glue, Thiourea, and Chloride on the Electrochemical Reduction in CuSO4–H2SO4 Solutions. Metals 2023, 13, 891.
https://doi.org/10.3390/met13050891
AMA Style
Nevárez-Llamas ÉD, Araneda-Hernández EA, Parra-Sánchez VR, Villagrán-Guerra EA.
Effect of Glue, Thiourea, and Chloride on the Electrochemical Reduction in CuSO4–H2SO4 Solutions. Metals. 2023; 13(5):891.
https://doi.org/10.3390/met13050891
Chicago/Turabian Style
Nevárez-Llamas, Érika D., Eugenia A. Araneda-Hernández, VÃctor R. Parra-Sánchez, and Eduardo A. Villagrán-Guerra.
2023. "Effect of Glue, Thiourea, and Chloride on the Electrochemical Reduction in CuSO4–H2SO4 Solutions" Metals 13, no. 5: 891.
https://doi.org/10.3390/met13050891
APA Style
Nevárez-Llamas, É. D., Araneda-Hernández, E. A., Parra-Sánchez, V. R., & Villagrán-Guerra, E. A.
(2023). Effect of Glue, Thiourea, and Chloride on the Electrochemical Reduction in CuSO4–H2SO4 Solutions. Metals, 13(5), 891.
https://doi.org/10.3390/met13050891