Liang, Z.; Shen, F.; Yang, Z.; Xu, D.; Wei, S.; Peng, Z.; Wang, L.; Wang, D.
Effects of Isothermal Aging on Interfacial Microstructure and Shear Properties of Sn-4.5Sb-3.5Bi-0.1Ag Soldering with ENIG and ENEPIG Substrates. Metals 2021, 11, 2027.
https://doi.org/10.3390/met11122027
AMA Style
Liang Z, Shen F, Yang Z, Xu D, Wei S, Peng Z, Wang L, Wang D.
Effects of Isothermal Aging on Interfacial Microstructure and Shear Properties of Sn-4.5Sb-3.5Bi-0.1Ag Soldering with ENIG and ENEPIG Substrates. Metals. 2021; 11(12):2027.
https://doi.org/10.3390/met11122027
Chicago/Turabian Style
Liang, Zhimin, Fei Shen, Zongyuan Yang, Da Xu, Shaowei Wei, Zhenzhen Peng, Liwei Wang, and Dianlong Wang.
2021. "Effects of Isothermal Aging on Interfacial Microstructure and Shear Properties of Sn-4.5Sb-3.5Bi-0.1Ag Soldering with ENIG and ENEPIG Substrates" Metals 11, no. 12: 2027.
https://doi.org/10.3390/met11122027
APA Style
Liang, Z., Shen, F., Yang, Z., Xu, D., Wei, S., Peng, Z., Wang, L., & Wang, D.
(2021). Effects of Isothermal Aging on Interfacial Microstructure and Shear Properties of Sn-4.5Sb-3.5Bi-0.1Ag Soldering with ENIG and ENEPIG Substrates. Metals, 11(12), 2027.
https://doi.org/10.3390/met11122027
