Wu, J.; Chen, F.; Liu, J.; Chen, R.; Liu, P.; Zhao, H.; Zhao, Z.
Analysis of Residual Stress at the Interface of Epoxy-Resin/Silicon-Wafer Composites During Thermal Aging. Polymers 2025, 17, 50.
https://doi.org/10.3390/polym17010050
AMA Style
Wu J, Chen F, Liu J, Chen R, Liu P, Zhao H, Zhao Z.
Analysis of Residual Stress at the Interface of Epoxy-Resin/Silicon-Wafer Composites During Thermal Aging. Polymers. 2025; 17(1):50.
https://doi.org/10.3390/polym17010050
Chicago/Turabian Style
Wu, Jianyu, Fangzhou Chen, Jiahao Liu, Rui Chen, Peijiang Liu, Hao Zhao, and Zhenbo Zhao.
2025. "Analysis of Residual Stress at the Interface of Epoxy-Resin/Silicon-Wafer Composites During Thermal Aging" Polymers 17, no. 1: 50.
https://doi.org/10.3390/polym17010050
APA Style
Wu, J., Chen, F., Liu, J., Chen, R., Liu, P., Zhao, H., & Zhao, Z.
(2025). Analysis of Residual Stress at the Interface of Epoxy-Resin/Silicon-Wafer Composites During Thermal Aging. Polymers, 17(1), 50.
https://doi.org/10.3390/polym17010050