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Journal: Polymers, 2024
Volume: 16
Number: 562
562
Article: Mold Fungal Resistance of Loose-Fill Thermal Insulation Materials Based on Processed Wheat Straw, Corn Stalk and Reed
Authors: by Ramunas Tupciauskas, Zigmunds Orlovskis, Karlis Trevors Blums, Janis Liepins, Andris Berzins, Gunars Pavlovics and Martins Andzs
Link: https://www.mdpi.com/2073-4360/16/4/562

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