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Polymers
  • Correction
  • Open Access

29 September 2024

Correction: Nimbalkar et al. A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates. Polymers 2023, 15, 3895

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1
3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA 30332, USA
2
Department of Electrical Engineering, Pennsylvania State University, University Park, PA 16802, USA
*
Author to whom correspondence should be addressed.

Error in Table

In the original publication [1], there was a mistake in Table 2 as published. The values of Tensile Strength with respect to Parylene-N, Parylene-C, Parylene-D, and Parylene-HT were incorrect. The corrected Table 2 appears below. The authors state that the scientific conclusions are unaffected. This correction was approved by the Academic Editor. The original publication has also been updated [1].
Table 2. Survey of commercially available polymer dielectrics.

Reference

  1. Nimbalkar, P.; Bhaskar, P.; Kathaperumal, M.; Swaminathan, M.; Tummala, R.R. A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates. Polymers 2023, 15, 3895. [Google Scholar] [CrossRef] [PubMed]
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