Lee Sanchez, W.A.; Huang, C.-Y.; Chen, J.-X.; Soong, Y.-C.; Chan, Y.-N.; Chiou, K.-C.; Lee, T.-M.; Cheng, C.-C.; Chiu, C.-W.
Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials. Polymers 2021, 13, 147.
https://doi.org/10.3390/polym13010147
AMA Style
Lee Sanchez WA, Huang C-Y, Chen J-X, Soong Y-C, Chan Y-N, Chiou K-C, Lee T-M, Cheng C-C, Chiu C-W.
Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials. Polymers. 2021; 13(1):147.
https://doi.org/10.3390/polym13010147
Chicago/Turabian Style
Lee Sanchez, William Anderson, Chen-Yang Huang, Jian-Xun Chen, Yu-Chian Soong, Ying-Nan Chan, Kuo-Chan Chiou, Tzong-Ming Lee, Chih-Chia Cheng, and Chih-Wei Chiu.
2021. "Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials" Polymers 13, no. 1: 147.
https://doi.org/10.3390/polym13010147
APA Style
Lee Sanchez, W. A., Huang, C.-Y., Chen, J.-X., Soong, Y.-C., Chan, Y.-N., Chiou, K.-C., Lee, T.-M., Cheng, C.-C., & Chiu, C.-W.
(2021). Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials. Polymers, 13(1), 147.
https://doi.org/10.3390/polym13010147