Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials
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Lee Sanchez, W.A.; Huang, C.-Y.; Chen, J.-X.; Soong, Y.-C.; Chan, Y.-N.; Chiou, K.-C.; Lee, T.-M.; Cheng, C.-C.; Chiu, C.-W. Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials. Polymers 2021, 13, 147. https://doi.org/10.3390/polym13010147
Lee Sanchez WA, Huang C-Y, Chen J-X, Soong Y-C, Chan Y-N, Chiou K-C, Lee T-M, Cheng C-C, Chiu C-W. Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials. Polymers. 2021; 13(1):147. https://doi.org/10.3390/polym13010147
Chicago/Turabian StyleLee Sanchez, William A., Chen-Yang Huang, Jian-Xun Chen, Yu-Chian Soong, Ying-Nan Chan, Kuo-Chan Chiou, Tzong-Ming Lee, Chih-Chia Cheng, and Chih-Wei Chiu. 2021. "Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials" Polymers 13, no. 1: 147. https://doi.org/10.3390/polym13010147


