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Article

Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials

1
Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 10607, Taiwan
2
Material and Chemical Research Laboratories, Industrial Technology Research Institute, Hsinchu 31040, Taiwan
3
Graduate Institute of Applied Science and Technology, National Taiwan University of Science and Technology, Taipei 10607, Taiwan
*
Author to whom correspondence should be addressed.
Polymers 2021, 13(1), 147; https://doi.org/10.3390/polym13010147
Received: 15 December 2020 / Revised: 29 December 2020 / Accepted: 29 December 2020 / Published: 1 January 2021
(This article belongs to the Special Issue Reinforced Polymer Composites II)
In this study, a thermal conductivity of 0.22 W·m−1·K−1 was obtained for pristine epoxy (EP), and the impact of a hybrid filler composed of two-dimensional (2D) flake-like boron nitride (BN) and zero-dimensional (0D) spherical micro-sized aluminum oxide (Al2O3) on the thermal conductivity of epoxy resin was investigated. With 80 wt.% hybrid Al2O3–BN filler contents, the thermal conductivity of the EP composite reached 1.72 W·m−1·K−1, increasing approximately 7.8-fold with respect to the pure epoxy matrix. Furthermore, different important properties for the application were analyzed, such as Fourier-transform infrared (FTIR) spectra, viscosity, morphology, coefficient of thermal expansion (CTE), glass transition temperature (Tg), decomposition temperature (Td), dielectric properties, and thermal infrared images. The obtained thermal performance is suitable for specific electronic applications such as flip-chip underfill packaging. View Full-Text
Keywords: underfill encapsulation; aluminum oxide; boron nitride; hybrid filler; thermal conductivity; coefficient of thermal expansion underfill encapsulation; aluminum oxide; boron nitride; hybrid filler; thermal conductivity; coefficient of thermal expansion
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MDPI and ACS Style

Lee Sanchez, W.A.; Huang, C.-Y.; Chen, J.-X.; Soong, Y.-C.; Chan, Y.-N.; Chiou, K.-C.; Lee, T.-M.; Cheng, C.-C.; Chiu, C.-W. Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials. Polymers 2021, 13, 147. https://doi.org/10.3390/polym13010147

AMA Style

Lee Sanchez WA, Huang C-Y, Chen J-X, Soong Y-C, Chan Y-N, Chiou K-C, Lee T-M, Cheng C-C, Chiu C-W. Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials. Polymers. 2021; 13(1):147. https://doi.org/10.3390/polym13010147

Chicago/Turabian Style

Lee Sanchez, William A., Chen-Yang Huang, Jian-Xun Chen, Yu-Chian Soong, Ying-Nan Chan, Kuo-Chan Chiou, Tzong-Ming Lee, Chih-Chia Cheng, and Chih-Wei Chiu. 2021. "Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials" Polymers 13, no. 1: 147. https://doi.org/10.3390/polym13010147

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