Wang, S.; Shi, G.; Zhao, L.; Dai, Y.; Hou, T.; He, Y.; Chen, P.; Qin, F.
Modelling and Optimization of Continual Laser Joining Processes for Silicon Aluminum Alloy in Microwave Devices. Crystals 2023, 13, 631.
https://doi.org/10.3390/cryst13040631
AMA Style
Wang S, Shi G, Zhao L, Dai Y, Hou T, He Y, Chen P, Qin F.
Modelling and Optimization of Continual Laser Joining Processes for Silicon Aluminum Alloy in Microwave Devices. Crystals. 2023; 13(4):631.
https://doi.org/10.3390/cryst13040631
Chicago/Turabian Style
Wang, Song, Ge Shi, Libo Zhao, Yanwei Dai, Tianyu Hou, Ying He, Ping Chen, and Fei Qin.
2023. "Modelling and Optimization of Continual Laser Joining Processes for Silicon Aluminum Alloy in Microwave Devices" Crystals 13, no. 4: 631.
https://doi.org/10.3390/cryst13040631
APA Style
Wang, S., Shi, G., Zhao, L., Dai, Y., Hou, T., He, Y., Chen, P., & Qin, F.
(2023). Modelling and Optimization of Continual Laser Joining Processes for Silicon Aluminum Alloy in Microwave Devices. Crystals, 13(4), 631.
https://doi.org/10.3390/cryst13040631