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Journal: Micromachines, 2018
Volume: 9
Number: 579

Article: High Performance Seesaw Torsional CMOS-MEMS Relay Using Tungsten VIA Layer
Authors: by Martín Riverola, Francesc Torres, Arantxa Uranga and Núria Barniol
Link: https://www.mdpi.com/2072-666X/9/11/579

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