Next Article in Journal
Microfluidic-Based 3D Engineered Microvascular Networks and Their Applications in Vascularized Microtumor Models
Next Article in Special Issue
Experimental Study of the Influence of Ink Properties and Process Parameters on Ejection Volume in Electrohydrodynamic Jet Printing
Previous Article in Journal
Microfabrication of Nonplanar Polymeric Microfluidics
Previous Article in Special Issue
The Use of a Water Soluble Flexible Substrate to Embed Electronics in Additively Manufactured Objects: From Tattoo to Water Transfer Printed Electronics
Article

Universal Testing Apparatus Implementing Various Repetitive Mechanical Deformations to Evaluate the Reliability of Flexible Electronic Devices

by 1 and 2,*
1
Department of Mechanical Engineering, Chungnam National University, 99 Daehak-ro, Daejeon 34134, Korea
2
Department of Mechanical & Metallurgical Engineering Education, Chungnam National University, 99 Daehak-ro, Daejeon 34134, Korea
*
Author to whom correspondence should be addressed.
Micromachines 2018, 9(10), 492; https://doi.org/10.3390/mi9100492
Received: 2 September 2018 / Revised: 19 September 2018 / Accepted: 24 September 2018 / Published: 25 September 2018
(This article belongs to the Special Issue Printed Flexible and Stretchable Electronics)
A requirement of flexible electronic devices is that they maintain their electrical performance during and after repetitive mechanical deformation. Accordingly, in this study, a universal test apparatus is developed for in-situ electrical conductivity measurements for flexible electrodes that are capable of applying various mechanical deformations such as bending, twisting, shearing, sliding, stretching, and complex modes consisting of two simultaneous deformations. A novel method of deforming the specimen in an arc to induce uniform bending stress in single and alternating directions is also proposed with a mathematically derived control method. As an example of the arc bending method, the changes in the resistance of the printed radio frequency identification (RFID) tag antennas were measured by applying repetitive inner bending, outer bending, and alternating inner-outer bending. After 5000 cycles, the increases in resistance of the specimens that were subjected to inner or outer bending only were under 30%; however, specimens that were subjected to alternating inner-outer bending showed an increase of 135% in resistance. It is critical that the reliability of flexible electronic devices under various mechanical deformations be determined before they can be commercialized. The proposed testing apparatus can readily provide various deformations that will be useful to inform the design of device shapes and structures to accommodate deformations during use. View Full-Text
Keywords: flexible electronics; printed electronics; mechanical deformation; test apparatus; reliability flexible electronics; printed electronics; mechanical deformation; test apparatus; reliability
Show Figures

Figure 1

MDPI and ACS Style

Kim, C.; Kim, C.H. Universal Testing Apparatus Implementing Various Repetitive Mechanical Deformations to Evaluate the Reliability of Flexible Electronic Devices. Micromachines 2018, 9, 492. https://doi.org/10.3390/mi9100492

AMA Style

Kim C, Kim CH. Universal Testing Apparatus Implementing Various Repetitive Mechanical Deformations to Evaluate the Reliability of Flexible Electronic Devices. Micromachines. 2018; 9(10):492. https://doi.org/10.3390/mi9100492

Chicago/Turabian Style

Kim, Cheol, and Chung H. Kim 2018. "Universal Testing Apparatus Implementing Various Repetitive Mechanical Deformations to Evaluate the Reliability of Flexible Electronic Devices" Micromachines 9, no. 10: 492. https://doi.org/10.3390/mi9100492

Find Other Styles
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Article Access Map by Country/Region

1
Back to TopTop