Ju, L.; Jiang, P.; Ren, Y.; Liu, R.; Kong, Y.; Yun, S.; Ye, Y.; Jiao, B.; Hao, Q.; Sun, H.
Overview of Research Progress and Application Prospects of Thermal Test Chips. Micromachines 2025, 16, 669.
https://doi.org/10.3390/mi16060669
AMA Style
Ju L, Jiang P, Ren Y, Liu R, Kong Y, Yun S, Ye Y, Jiao B, Hao Q, Sun H.
Overview of Research Progress and Application Prospects of Thermal Test Chips. Micromachines. 2025; 16(6):669.
https://doi.org/10.3390/mi16060669
Chicago/Turabian Style
Ju, Lina, Peng Jiang, Yu Ren, Ruiwen Liu, Yanmei Kong, Shichang Yun, Yuxin Ye, Binbin Jiao, Qixing Hao, and Honglin Sun.
2025. "Overview of Research Progress and Application Prospects of Thermal Test Chips" Micromachines 16, no. 6: 669.
https://doi.org/10.3390/mi16060669
APA Style
Ju, L., Jiang, P., Ren, Y., Liu, R., Kong, Y., Yun, S., Ye, Y., Jiao, B., Hao, Q., & Sun, H.
(2025). Overview of Research Progress and Application Prospects of Thermal Test Chips. Micromachines, 16(6), 669.
https://doi.org/10.3390/mi16060669