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Journal: MicromachinesVolume: 16Number: 648
Article: Validation of Experimental Cooling Performance of Multi-Stage Thin-Film Thermoelectric Devices via Numerical Simulation
  • Authors:
  • Yu Ning1,
  • Longzhou Li1 and
  • Ping Wei1,*
  • et al.
Link: https://www.mdpi.com/2072-666X/16/6/648

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