Cao, Y.; Wang, B.; Li, Z.; Wang, J.; Xiao, Y.; Zeng, Q.; Wang, X.; Zhang, W.; Zhang, Q.; Sheng, L.
Improvement of Micro-Hole Processing in SiCf/SiC Ceramic Matrix Composite Using Efficient Two-Step Laser Drilling. Micromachines 2025, 16, 430.
https://doi.org/10.3390/mi16040430
AMA Style
Cao Y, Wang B, Li Z, Wang J, Xiao Y, Zeng Q, Wang X, Zhang W, Zhang Q, Sheng L.
Improvement of Micro-Hole Processing in SiCf/SiC Ceramic Matrix Composite Using Efficient Two-Step Laser Drilling. Micromachines. 2025; 16(4):430.
https://doi.org/10.3390/mi16040430
Chicago/Turabian Style
Cao, Yue, Bin Wang, Zhehang Li, Jiajia Wang, Yinan Xiao, Qingyang Zeng, Xinfeng Wang, Wenwu Zhang, Qunli Zhang, and Liyuan Sheng.
2025. "Improvement of Micro-Hole Processing in SiCf/SiC Ceramic Matrix Composite Using Efficient Two-Step Laser Drilling" Micromachines 16, no. 4: 430.
https://doi.org/10.3390/mi16040430
APA Style
Cao, Y., Wang, B., Li, Z., Wang, J., Xiao, Y., Zeng, Q., Wang, X., Zhang, W., Zhang, Q., & Sheng, L.
(2025). Improvement of Micro-Hole Processing in SiCf/SiC Ceramic Matrix Composite Using Efficient Two-Step Laser Drilling. Micromachines, 16(4), 430.
https://doi.org/10.3390/mi16040430
