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Micromachines
Volume 16
Issue 4
10.3390/mi16040390
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Correction to Micromachines 2022, 13(9), 1513.
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Correction

Correction: Arshad et al. A Comparative Modelling Study of New Robust Packaging Technology 1 mm2 VCSEL Packages and Their Mechanical Stress Properties. Micromachines 2022, 13, 1513

by
Khairul Mohd Arshad
1,
Muhamad Mat Noor
2,
Asrulnizam Abd Manaf
3,
Hiroshi Kawarada
4,5,
Shaili Falina
3,4 and
Mohd Syamsul
1,4,*
1
Institute of Nano Optoelectronics Research and Technology (INOR), Universiti Sains Malaysia, Sains@USM, Bayan Lepas 11900, Pulau Pinang, Malaysia
2
Faculty of Mechanical and Automotive Engineering Technology, Universiti Malaysia Pahang, Pekan 26600, Pahang, Malaysia
3
Collaborative Microelectronic Design Excellence Centre (CEDEC), Universiti Sains Malaysia, Sains@USM, Bayan Lepas 11900, Pulau Pinang, Malaysia
4
Faculty of Science and Engineering, Waseda University, Shinjuku, Tokyo 169-8555, Japan
5
The Kagami Memorial Laboratory for Materials Science and Technology, Waseda University, 2-8-26 Nishiwaseda, Shinjuku, Tokyo 169-0051, Japan
*
Author to whom correspondence should be addressed.
Micromachines 2025, 16(4), 390; https://doi.org/10.3390/mi16040390
Submission received: 21 January 2025 / Accepted: 7 February 2025 / Published: 28 March 2025
Browse Figures
Versions Notes

Error in Figure 1a,b

In the original publication [1], there was a mistake in ‘Figure 1. The VCSEL package. (a) component structure for package; (b) the actual package with diffuser and SEM image for microstructure on top lens’, as published. ‘Should be just share the illustration image for package and microstructure lens on top of lens’. The corrected ‘Figure 1. (a) The illustration of VCSEL package; (b) the illustration of microstructure of lens on top of VCSEL package’ appears below.
Micromachines 16 00390 g001
Figure 1. (a) The illustration of VCSEL package; (b) the illustration of microstructure of lens on top of VCSEL package.
Figure 1. (a) The illustration of VCSEL package; (b) the illustration of microstructure of lens on top of VCSEL package.
Micromachines 16 00390 g001

Error in Figure 2

In the original publication [1], there was a mistake in ‘Figure 2. The convex share structure was developed for the microstructure of the diffuser on the top of a lens’, as published. ‘Should be just share the illustration image microstructure lens on top of lens’. The corrected ‘Figure 2. The illustration of the microstructure of the lens on top of the VCSEL package’ appears below.
Micromachines 16 00390 g002
Figure 2. The illustration of the microstructure of the lens on top of the VCSEL package.
Figure 2. The illustration of the microstructure of the lens on top of the VCSEL package.
Micromachines 16 00390 g002

Error in Figure 3

In the original publication [1], there was a mistake in ‘Figure 3. (a) Top view optical image of the cracked lens unit of VCSEL; (b) cross section view optical images of cracks observed in different positions labeled A–E; and (c) SEM images of respective positions’, as published. ‘Should be just share the illustration of microstructure lens have crack and damage’. The corrected ‘Figure 3. (a,b) The illustration of microstructure has crack and damage of microstructure lens’ appears below.
Micromachines 16 00390 g003
Figure 3. (a,b) The illustration of microstructure has crack and damage of microstructure lens.
Figure 3. (a,b) The illustration of microstructure has crack and damage of microstructure lens.
Micromachines 16 00390 g003
The authors state that the scientific conclusions are unaffected. This correction was approved by the Academic Editor. The original publication has also been updated.

Reference

  1. Arshad, K.M.; Noor, M.M.; Manaf, A.A.; Kawarada, H.; Falina, S.; Syamsul, M. A Comparative Modelling Study of New Robust Packaging Technology 1 mm2 VCSEL Packages and Their Mechanical Stress Properties. Micromachines 2022, 13, 1513. [Google Scholar] [CrossRef] [PubMed]
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Share and Cite

MDPI and ACS Style

Arshad, K.M.; Noor, M.M.; Manaf, A.A.; Kawarada, H.; Falina, S.; Syamsul, M. Correction: Arshad et al. A Comparative Modelling Study of New Robust Packaging Technology 1 mm2 VCSEL Packages and Their Mechanical Stress Properties. Micromachines 2022, 13, 1513. Micromachines 2025, 16, 390. https://doi.org/10.3390/mi16040390

AMA Style

Arshad KM, Noor MM, Manaf AA, Kawarada H, Falina S, Syamsul M. Correction: Arshad et al. A Comparative Modelling Study of New Robust Packaging Technology 1 mm2 VCSEL Packages and Their Mechanical Stress Properties. Micromachines 2022, 13, 1513. Micromachines. 2025; 16(4):390. https://doi.org/10.3390/mi16040390

Chicago/Turabian Style

Arshad, Khairul Mohd, Muhamad Mat Noor, Asrulnizam Abd Manaf, Hiroshi Kawarada, Shaili Falina, and Mohd Syamsul. 2025. "Correction: Arshad et al. A Comparative Modelling Study of New Robust Packaging Technology 1 mm2 VCSEL Packages and Their Mechanical Stress Properties. Micromachines 2022, 13, 1513" Micromachines 16, no. 4: 390. https://doi.org/10.3390/mi16040390

APA Style

Arshad, K. M., Noor, M. M., Manaf, A. A., Kawarada, H., Falina, S., & Syamsul, M. (2025). Correction: Arshad et al. A Comparative Modelling Study of New Robust Packaging Technology 1 mm2 VCSEL Packages and Their Mechanical Stress Properties. Micromachines 2022, 13, 1513. Micromachines, 16(4), 390. https://doi.org/10.3390/mi16040390

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