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Journal: Micromachines, 2025
Volume: 16
Number: 321

Article: Impact of Bonding Pressure on the Reactive Bonding of LTCC Substrates
Authors: by Erik Wiss, Nesrine Jaziri, Jens Müller and Steffen Wiese
Link: https://www.mdpi.com/2072-666X/16/3/321

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