Tian, W.; Li, D.; Dang, H.; Liang, S.; Zhang, Y.; Zhang, X.; Chen, S.; Yu, X.
Residual Stress and Warping Analysis of the Nano-Silver Pressureless Sintering Process in SiC Power Device Packaging. Micromachines 2024, 15, 1087.
https://doi.org/10.3390/mi15091087
AMA Style
Tian W, Li D, Dang H, Liang S, Zhang Y, Zhang X, Chen S, Yu X.
Residual Stress and Warping Analysis of the Nano-Silver Pressureless Sintering Process in SiC Power Device Packaging. Micromachines. 2024; 15(9):1087.
https://doi.org/10.3390/mi15091087
Chicago/Turabian Style
Tian, Wenchao, Dexin Li, Haojie Dang, Shiqian Liang, Yizheng Zhang, Xiaojun Zhang, Si Chen, and Xiaochuan Yu.
2024. "Residual Stress and Warping Analysis of the Nano-Silver Pressureless Sintering Process in SiC Power Device Packaging" Micromachines 15, no. 9: 1087.
https://doi.org/10.3390/mi15091087
APA Style
Tian, W., Li, D., Dang, H., Liang, S., Zhang, Y., Zhang, X., Chen, S., & Yu, X.
(2024). Residual Stress and Warping Analysis of the Nano-Silver Pressureless Sintering Process in SiC Power Device Packaging. Micromachines, 15(9), 1087.
https://doi.org/10.3390/mi15091087
