Chen, X.; Chen, Z.; Xiao, L.; Hao, Y.; Wang, H.; Ding, Y.; Zhang, Z.
Fabrication and Electrical Characterization of High Aspect Ratio Through-Silicon Vias with Polyimide Liner for 3D Integration. Micromachines 2022, 13, 1147.
https://doi.org/10.3390/mi13071147
AMA Style
Chen X, Chen Z, Xiao L, Hao Y, Wang H, Ding Y, Zhang Z.
Fabrication and Electrical Characterization of High Aspect Ratio Through-Silicon Vias with Polyimide Liner for 3D Integration. Micromachines. 2022; 13(7):1147.
https://doi.org/10.3390/mi13071147
Chicago/Turabian Style
Chen, Xuyan, Zhiming Chen, Lei Xiao, Yigang Hao, Han Wang, Yingtao Ding, and Ziyue Zhang.
2022. "Fabrication and Electrical Characterization of High Aspect Ratio Through-Silicon Vias with Polyimide Liner for 3D Integration" Micromachines 13, no. 7: 1147.
https://doi.org/10.3390/mi13071147
APA Style
Chen, X., Chen, Z., Xiao, L., Hao, Y., Wang, H., Ding, Y., & Zhang, Z.
(2022). Fabrication and Electrical Characterization of High Aspect Ratio Through-Silicon Vias with Polyimide Liner for 3D Integration. Micromachines, 13(7), 1147.
https://doi.org/10.3390/mi13071147