Kim, H.; Lee, S.; Song, K.; Shin, Y.; Park, D.; Park, J.; Cho, J.; Ahn, S.
A Novel Interposer Channel Structure with Vertical Tabbed Vias to Reduce Far-End Crosstalk for Next-Generation High-Bandwidth Memory. Micromachines 2022, 13, 1070.
https://doi.org/10.3390/mi13071070
AMA Style
Kim H, Lee S, Song K, Shin Y, Park D, Park J, Cho J, Ahn S.
A Novel Interposer Channel Structure with Vertical Tabbed Vias to Reduce Far-End Crosstalk for Next-Generation High-Bandwidth Memory. Micromachines. 2022; 13(7):1070.
https://doi.org/10.3390/mi13071070
Chicago/Turabian Style
Kim, Hyunwoong, Seonghi Lee, Kyunghwan Song, Yujun Shin, Dongyrul Park, Jongcheol Park, Jaeyong Cho, and Seungyoung Ahn.
2022. "A Novel Interposer Channel Structure with Vertical Tabbed Vias to Reduce Far-End Crosstalk for Next-Generation High-Bandwidth Memory" Micromachines 13, no. 7: 1070.
https://doi.org/10.3390/mi13071070
APA Style
Kim, H., Lee, S., Song, K., Shin, Y., Park, D., Park, J., Cho, J., & Ahn, S.
(2022). A Novel Interposer Channel Structure with Vertical Tabbed Vias to Reduce Far-End Crosstalk for Next-Generation High-Bandwidth Memory. Micromachines, 13(7), 1070.
https://doi.org/10.3390/mi13071070