Park, H.; Choi, W.; Oh, S.; Kim, Y.-J.; Seok, S.; Kim, J.
A Study on Biocompatible Polymer-Based Packaging of Neural Interface for Chronic Implantation. Micromachines 2022, 13, 516.
https://doi.org/10.3390/mi13040516
AMA Style
Park H, Choi W, Oh S, Kim Y-J, Seok S, Kim J.
A Study on Biocompatible Polymer-Based Packaging of Neural Interface for Chronic Implantation. Micromachines. 2022; 13(4):516.
https://doi.org/10.3390/mi13040516
Chicago/Turabian Style
Park, HyungDal, Wonsuk Choi, Seonghwan Oh, Yong-Jun Kim, Seonho Seok, and Jinseok Kim.
2022. "A Study on Biocompatible Polymer-Based Packaging of Neural Interface for Chronic Implantation" Micromachines 13, no. 4: 516.
https://doi.org/10.3390/mi13040516
APA Style
Park, H., Choi, W., Oh, S., Kim, Y.-J., Seok, S., & Kim, J.
(2022). A Study on Biocompatible Polymer-Based Packaging of Neural Interface for Chronic Implantation. Micromachines, 13(4), 516.
https://doi.org/10.3390/mi13040516