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Journal: MicromachinesVolume: 13Number: 1976
Article: Multi-Band Power Amplifier Module with Back-Off Efficiency Improvement using Ultra-Compact 3D Vertical Stack Multi-Chip Package for Cellular Handsets
  • Authors:
  • Zhihao Zhang1,
  • Jing Li2 and
  • Lin Peng1
  • et al.
Link: https://www.mdpi.com/2072-666X/13/11/1976

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