Wang, Z.; He, C.; Zhang, W.; Li, Y.; Gao, P.; Meng, Y.; Zhang, G.; Yang, Y.; Wang, R.; Cui, J.;
et al. Fabrication of 2-D Capacitive Micromachined Ultrasonic Transducer (CMUT) Array through Silicon Wafer Bonding. Micromachines 2022, 13, 99.
https://doi.org/10.3390/mi13010099
AMA Style
Wang Z, He C, Zhang W, Li Y, Gao P, Meng Y, Zhang G, Yang Y, Wang R, Cui J,
et al. Fabrication of 2-D Capacitive Micromachined Ultrasonic Transducer (CMUT) Array through Silicon Wafer Bonding. Micromachines. 2022; 13(1):99.
https://doi.org/10.3390/mi13010099
Chicago/Turabian Style
Wang, Ziyuan, Changde He, Wendong Zhang, Yifan Li, Pengfei Gao, Yanan Meng, Guojun Zhang, Yuhua Yang, Renxin Wang, Jiangong Cui,
and et al. 2022. "Fabrication of 2-D Capacitive Micromachined Ultrasonic Transducer (CMUT) Array through Silicon Wafer Bonding" Micromachines 13, no. 1: 99.
https://doi.org/10.3390/mi13010099
APA Style
Wang, Z., He, C., Zhang, W., Li, Y., Gao, P., Meng, Y., Zhang, G., Yang, Y., Wang, R., Cui, J., Wang, H., Zhang, B., Ren, Y., Zhen, G., Jiao, X., & Zhang, S.
(2022). Fabrication of 2-D Capacitive Micromachined Ultrasonic Transducer (CMUT) Array through Silicon Wafer Bonding. Micromachines, 13(1), 99.
https://doi.org/10.3390/mi13010099
