Yang, N.; Jiang, X.; Zhang, R.; Li, J.; Zheng, K.; Pan, F.
The Effects of Cu Powder on the Interface Microstructure Evolution of Hot-Rolled Al 6061/Mg M21/Al 6061 Composite Plates During Annealing. Materials 2025, 18, 655.
https://doi.org/10.3390/ma18030655
AMA Style
Yang N, Jiang X, Zhang R, Li J, Zheng K, Pan F.
The Effects of Cu Powder on the Interface Microstructure Evolution of Hot-Rolled Al 6061/Mg M21/Al 6061 Composite Plates During Annealing. Materials. 2025; 18(3):655.
https://doi.org/10.3390/ma18030655
Chicago/Turabian Style
Yang, Na, Xianquan Jiang, Ruihao Zhang, Jian Li, Kaihong Zheng, and Fusheng Pan.
2025. "The Effects of Cu Powder on the Interface Microstructure Evolution of Hot-Rolled Al 6061/Mg M21/Al 6061 Composite Plates During Annealing" Materials 18, no. 3: 655.
https://doi.org/10.3390/ma18030655
APA Style
Yang, N., Jiang, X., Zhang, R., Li, J., Zheng, K., & Pan, F.
(2025). The Effects of Cu Powder on the Interface Microstructure Evolution of Hot-Rolled Al 6061/Mg M21/Al 6061 Composite Plates During Annealing. Materials, 18(3), 655.
https://doi.org/10.3390/ma18030655