Liu, M.; Wang, R.; Hou, S.; Shang, K.; Gesang, D.; Wei, G.
Finite Element Analysis of Thermal–Mechanical Coupling and Process Parameter Optimization in Laser Etching of Al–Tedlar–Kevlar Composite Films. Materials 2025, 18, 4839.
https://doi.org/10.3390/ma18214839
AMA Style
Liu M, Wang R, Hou S, Shang K, Gesang D, Wei G.
Finite Element Analysis of Thermal–Mechanical Coupling and Process Parameter Optimization in Laser Etching of Al–Tedlar–Kevlar Composite Films. Materials. 2025; 18(21):4839.
https://doi.org/10.3390/ma18214839
Chicago/Turabian Style
Liu, Ming, Rui Wang, Shanglin Hou, Kaiwen Shang, Dunzhu Gesang, and Guang Wei.
2025. "Finite Element Analysis of Thermal–Mechanical Coupling and Process Parameter Optimization in Laser Etching of Al–Tedlar–Kevlar Composite Films" Materials 18, no. 21: 4839.
https://doi.org/10.3390/ma18214839
APA Style
Liu, M., Wang, R., Hou, S., Shang, K., Gesang, D., & Wei, G.
(2025). Finite Element Analysis of Thermal–Mechanical Coupling and Process Parameter Optimization in Laser Etching of Al–Tedlar–Kevlar Composite Films. Materials, 18(21), 4839.
https://doi.org/10.3390/ma18214839