Nogita, K.; Tan, X.F.; Zhou, J.; McDonald, S.D.; Sweatman, K.; Somidin, F.; Zeng, G.; Maeno, H.; Yasuda, K.; Gourlay, C.M.
In Situ Observation of Deformation in a Sn-3Ag-0.5Cu/Cu Solder Joint Using High-Voltage Transmission Electron Microscopy. Materials 2025, 18, 3925.
https://doi.org/10.3390/ma18163925
AMA Style
Nogita K, Tan XF, Zhou J, McDonald SD, Sweatman K, Somidin F, Zeng G, Maeno H, Yasuda K, Gourlay CM.
In Situ Observation of Deformation in a Sn-3Ag-0.5Cu/Cu Solder Joint Using High-Voltage Transmission Electron Microscopy. Materials. 2025; 18(16):3925.
https://doi.org/10.3390/ma18163925
Chicago/Turabian Style
Nogita, Kazuhiro, Xin Fu Tan, Jiye Zhou, Stuart D. McDonald, Keith Sweatman, Flora Somidin, Guang Zeng, Hiroshi Maeno, Kazuhiro Yasuda, and Christopher M. Gourlay.
2025. "In Situ Observation of Deformation in a Sn-3Ag-0.5Cu/Cu Solder Joint Using High-Voltage Transmission Electron Microscopy" Materials 18, no. 16: 3925.
https://doi.org/10.3390/ma18163925
APA Style
Nogita, K., Tan, X. F., Zhou, J., McDonald, S. D., Sweatman, K., Somidin, F., Zeng, G., Maeno, H., Yasuda, K., & Gourlay, C. M.
(2025). In Situ Observation of Deformation in a Sn-3Ag-0.5Cu/Cu Solder Joint Using High-Voltage Transmission Electron Microscopy. Materials, 18(16), 3925.
https://doi.org/10.3390/ma18163925
