Lei, Y.; Sun, W.; Huang, X.; Wang, Y.; Gao, J.; Li, X.; Xiao, R.; Deng, B.
In Situ Multiphysical Metrology for Photonic Wire Bonding by Two-Photon Polymerization. Materials 2024, 17, 5297.
https://doi.org/10.3390/ma17215297
AMA Style
Lei Y, Sun W, Huang X, Wang Y, Gao J, Li X, Xiao R, Deng B.
In Situ Multiphysical Metrology for Photonic Wire Bonding by Two-Photon Polymerization. Materials. 2024; 17(21):5297.
https://doi.org/10.3390/ma17215297
Chicago/Turabian Style
Lei, Yu, Wentao Sun, Xiaolong Huang, Yan Wang, Jinling Gao, Xiaopei Li, Rulei Xiao, and Biwei Deng.
2024. "In Situ Multiphysical Metrology for Photonic Wire Bonding by Two-Photon Polymerization" Materials 17, no. 21: 5297.
https://doi.org/10.3390/ma17215297
APA Style
Lei, Y., Sun, W., Huang, X., Wang, Y., Gao, J., Li, X., Xiao, R., & Deng, B.
(2024). In Situ Multiphysical Metrology for Photonic Wire Bonding by Two-Photon Polymerization. Materials, 17(21), 5297.
https://doi.org/10.3390/ma17215297