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Journal: Materials, 2023
Volume: 16
Number: 860

Article: Through-Silicon via Device Non-Destructive Defect Evaluation Using Ultra-High-Resolution Acoustic Microscopy System
Authors: by Tae Hyeong Kim, Dongchan Kang, Jeong Nyeon Kim and Ik Keun Park
Link: https://www.mdpi.com/1996-1944/16/2/860

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