Modeling and Experimental Characterization of Bonding Delaminations in Single-Element Ultrasonic Transducer
Abstract
:1. Introduction
2. Materials and Methods
2.1. Studied Single-Element Transducer
2.2. Electromechanical Admittance
3. Finite Element Modeling
3.1. Delamination Types
3.2. Case I: Delaminations Between Ceramic and Backing
3.3. Case II: Delaminations Between Ceramic and Matching Layer
4. Experimental Validation
4.1. Experiment Setup
4.2. Comparison Between Experiment and FE modeling
5. Conclusions
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Acknowledgments
Conflicts of Interest
References
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ϕ (mm) | t (mm) | ρ (kg/m3) | (GPa) | (GPa) | (GPa) | (GPa) | (GPa) |
---|---|---|---|---|---|---|---|
16 | 1.13 | 7879.5 | 148.6 | 106.1 | 87.5 | 144.4 | 36.6 |
(GV/m) | (GV/m) | (GV/m) | (Gm/F) | (Gm/F) | (%) | (%) | Z (MRayl) |
−0.38 | 1.98 | 1.16 | 9.99 | 0.12 | 0.45 | 0.27 | 33.7 |
Components | ϕ (mm) | t (mm) | ρ (kg/m3) | (m/s) | (m/s) | (%) | Z (MRayl) |
---|---|---|---|---|---|---|---|
Backing | 16 | 20 | 1135 | 1738 | 952.2 | 5 | 1.97 |
Matching | 16 | 0.18 | 3284 | 1246 | 740.2 | 5 | 4.09 |
Bonding | 16 | 0.002 | 1250 | 2369 | 994 | 1 | 2.96 |
η (%) | DT-I (%) | DT-II (%) | DT-III (%) |
---|---|---|---|
25 | 1.7 | 1.6 | 0.6 |
50 | 4.2 | 2.7 | 14.9 |
75 | 5.7 | 5.5 | 6.6 |
η (%) | DT-I (%) | DT-II (%) | DT-III (%) |
---|---|---|---|
25 | 8.9 | 1.3 | 9.2 |
50 | 7.7 | 10.4 | 0.1 |
75 | 1.8 | 16.9 | 12.1 |
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Ding, W.; Bavencoffe, M.; Lethiecq, M. Modeling and Experimental Characterization of Bonding Delaminations in Single-Element Ultrasonic Transducer. Materials 2021, 14, 2269. https://doi.org/10.3390/ma14092269
Ding W, Bavencoffe M, Lethiecq M. Modeling and Experimental Characterization of Bonding Delaminations in Single-Element Ultrasonic Transducer. Materials. 2021; 14(9):2269. https://doi.org/10.3390/ma14092269
Chicago/Turabian StyleDing, Wenxiang, Maxime Bavencoffe, and Marc Lethiecq. 2021. "Modeling and Experimental Characterization of Bonding Delaminations in Single-Element Ultrasonic Transducer" Materials 14, no. 9: 2269. https://doi.org/10.3390/ma14092269