Next Article in Journal
Fabrication of 50.0 μm Ultra-Fine Pure Rhodium Wire, Using a Multi-Pass Wire Drawing Process, for Probe Card Pins
Previous Article in Journal
Effective Design of the Graded Strut of BCC Lattice Structure for Improving Mechanical Properties
Previous Article in Special Issue
Superinjection of Holes in Homojunction Diodes Based on Wide-Bandgap Semiconductors
Article Menu
Issue 13 (July-1) cover image

Export Article

Open AccessArticle

Numerical Simulation, Machining and Testing of a Phase Change Heat Sink for High Power LEDs

School of Mechanical and Electrical Engineering, Guangzhou University, Guangzhou 510006, China
*
Author to whom correspondence should be addressed.
Materials 2019, 12(13), 2193; https://doi.org/10.3390/ma12132193
Received: 30 May 2019 / Revised: 20 June 2019 / Accepted: 5 July 2019 / Published: 8 July 2019
(This article belongs to the Special Issue Advanced Materials and Devices in Solid State Lighting)
  |  
PDF [8671 KB, uploaded 8 July 2019]
  |  

Abstract

Thermal management is crucial to guarantee the normal operation of light-emitting diodes (LEDs) Phase change heat sink is superior to traditional metal solid heat sink due to very small thermal resistance. In this study, a new type of phase change heat sink for high power LEDs is first designed. Then, the fabrication process of boiling structures at the evaporation surface of the phase change heat sink is discussed and analyzed. To make a comparison and deep discussion, the machining process is simulated through the FEM (finite element analysis) software, DEFORM-3D. Last but not least, heat transfer performance of the fabricated phase change heat sink is tested. Results have shown that the designed new type of phase change heat sink has superior heat transfer performance and is suitable for heat dissipation of high-power LEDs. View Full-Text
Keywords: phase change heat sink; fabrication; numerical simulation; heat transfer testing; high power LED phase change heat sink; fabrication; numerical simulation; heat transfer testing; high power LED
Figures

Figure 1

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
SciFeed

Share & Cite This Article

MDPI and ACS Style

Xiang, J.; Zheng, H.; Wang, Y.; Zhang, C.; Zhou, C.; Chen, C. Numerical Simulation, Machining and Testing of a Phase Change Heat Sink for High Power LEDs. Materials 2019, 12, 2193.

Show more citation formats Show less citations formats

Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Related Articles

Article Metrics

Article Access Statistics

1

Comments

[Return to top]
Materials EISSN 1996-1944 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
Back to Top